Assembling electronic components on to printed circuit board (PCB) traditionally depends on soldering them on to that motherboard. In a well functioning reflow soldering oven, the best possible results are usually achieved. The technique is one of the most modern the widely used for this kind of attachments although just like other forms of technologies, it is too undergoing revolution.
The heat in the majority of these ovens is produced from ceramic infrared heaters, and then directed to assembly chambers through radiation process. The infrared ones uses fans to force heat into the assembly chambers where the PCB and the components are exposed to optimal temperatures for melting of the solder for permanent fixing of the components on to the PCB.
In a conventional reflow soldering oven, there are four phases or zone with a unique thermal profile for each. It all starts in the preheat zone where the time/temperature relationship (ramp-rate) is determined. This is the rate at which the temperature changes on the PCB and it is important so that the PCB does not crack or components do not get destroyed. The solvent in the paste starts to evaporate at this phase.
Thermal soak zone with temperature ranging from 60 to 120 is the next stage for the circuit board. The purpose is the removal of solder paste volatiles and flux activation (oxide reduction from leads and pads). Temperature control at this phase is also very essential. Too high temperature leads to damage to the PCB and the components while too low temperature leads for failure of full oxidation of flux.
The third phase is the reflow zone where the maximum possible temperatures are reached. The objective is to reduce the surface tension of the flux at the points of metal juncture which leads to metallurgical bonding involving combination of all the available solder powder. The maximum possible operating temperature is set slightly below the maximum tolerable temperature of that component with the lowest operating temperatures. The oven should therefore be efficient in heat control and monitoring.
Cooling takes place in the last phase also known as the cooling zone from where the molten solder solidifies into the precise target points permanently fixing the electronic components on to the PCB. The temperature control is still significant as such problems like thermal shock or the excessive metallic formation must be avoided I order to obtain a mechanically sound devices attached with fine grained structured solder.
In the modern ovens with the most up to date technology, there is usually no need for solder to flow more than once as these advances techniques guarantees that the granules in the paste can surpass the reflow temperature of the solder used. The trick is therefore to select an oven that can perform optimally at all the phases resulting into the best possible PCB with attached components.
The high rate of the change in business environment reflected by changing consumer needs, shifting technology, market changes and increasing competition all calls for drastic measures such as investing in highly efficient and optimally performing devices such as a reflow soldering oven which should drive production levels and increase profitability for the survival of the business.
The heat in the majority of these ovens is produced from ceramic infrared heaters, and then directed to assembly chambers through radiation process. The infrared ones uses fans to force heat into the assembly chambers where the PCB and the components are exposed to optimal temperatures for melting of the solder for permanent fixing of the components on to the PCB.
In a conventional reflow soldering oven, there are four phases or zone with a unique thermal profile for each. It all starts in the preheat zone where the time/temperature relationship (ramp-rate) is determined. This is the rate at which the temperature changes on the PCB and it is important so that the PCB does not crack or components do not get destroyed. The solvent in the paste starts to evaporate at this phase.
Thermal soak zone with temperature ranging from 60 to 120 is the next stage for the circuit board. The purpose is the removal of solder paste volatiles and flux activation (oxide reduction from leads and pads). Temperature control at this phase is also very essential. Too high temperature leads to damage to the PCB and the components while too low temperature leads for failure of full oxidation of flux.
The third phase is the reflow zone where the maximum possible temperatures are reached. The objective is to reduce the surface tension of the flux at the points of metal juncture which leads to metallurgical bonding involving combination of all the available solder powder. The maximum possible operating temperature is set slightly below the maximum tolerable temperature of that component with the lowest operating temperatures. The oven should therefore be efficient in heat control and monitoring.
Cooling takes place in the last phase also known as the cooling zone from where the molten solder solidifies into the precise target points permanently fixing the electronic components on to the PCB. The temperature control is still significant as such problems like thermal shock or the excessive metallic formation must be avoided I order to obtain a mechanically sound devices attached with fine grained structured solder.
In the modern ovens with the most up to date technology, there is usually no need for solder to flow more than once as these advances techniques guarantees that the granules in the paste can surpass the reflow temperature of the solder used. The trick is therefore to select an oven that can perform optimally at all the phases resulting into the best possible PCB with attached components.
The high rate of the change in business environment reflected by changing consumer needs, shifting technology, market changes and increasing competition all calls for drastic measures such as investing in highly efficient and optimally performing devices such as a reflow soldering oven which should drive production levels and increase profitability for the survival of the business.
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