SMT reflow soldering oven is used for attaching different electrical components to the boards. In this process, the solder paste, which is a mixture of powdered solder and flux, is used for connecting the joints permanently. Standard ovens used for this purpose are much larger, and this makes these types of devices more convenient for different purposes, for example, in labs.
These devices are generally used for different surface mount components. Using smaller, energy efficient and compact models provides reduced assembly costs. Computer controlled heat won't cause any damage to even the most sensitive parts. The whole process consists of at least four different stages, or more.
In the first stage, often called the preheat zone, the solvent in the paste begins to evaporate. In thermal soak zone the fluxes are temporarily attached. In the third stage, also called the reflow zone, the maximum temperature is reached. This temperature depends on the component with the lowest tolerance on high temperature.
The final stage of every reflow soldering process is the cooling stage. Gradual cooling is important for achieving the best grain structure of the solder joint, and manufacturers often advice the rate of approximately four degrees per second. Some other similar devices don't include this cooling zone, but experts agree about its importance.
There are different types of SMT soldering ovens, including medium to high volume models, the ones designed as bench top models, and also nitrogen based. Compared to standard devices designed for the same purpose, they provide lower energy consumption and take up less space. Compact and practical, they can find their usage in different processes.
Mid to high volume devices have four independent reflow zones, several thermocouple inputs and LCD touchscreen controls. This type of devices is often used for testing and prototyping. Their stainless steel mesh conveyor accepts up to twenty inch wide boards, and the combination conveyor provides maximum handling flexibility.
The whole process is computer operated and controlled. Parameters can be set automatically, or manually adjusted. The set of parameters can be saved to a memory. Once you reload the saved set, you can adjust individual parameters to suit your present needs. This include specific zone temperature settings and upper and lower limits.
These compact sized models provide very good efficiency, easy handling and low consumption of energy. Advanced thermal management options and other innovative possibilities are making them very useful in all types of industries. Safety systems include audible and visual alarms and automatic shutdown options.
Larger SMT ovens provide up to ten controlled upper and lower full-convection heating zones. They provide maximum functionality, automatic hood-life mechanism and high precision conveyor mechanism. This is a reliable solution for all medium and high volume manufacturers. It combines high mass heat sources with efficient thermal heat transfer, ensuring very good process stability.
SMT reflow soldering oven is very good replacement for standard devices used for attaching electrical components in different types of industries. Small, compact models are very good for schools, labs and small manufacturing processes. High volume models are designed to meet specific needs of high volume manufacturing processes, but all are additionally equipped with back-up batteries.
These devices are generally used for different surface mount components. Using smaller, energy efficient and compact models provides reduced assembly costs. Computer controlled heat won't cause any damage to even the most sensitive parts. The whole process consists of at least four different stages, or more.
In the first stage, often called the preheat zone, the solvent in the paste begins to evaporate. In thermal soak zone the fluxes are temporarily attached. In the third stage, also called the reflow zone, the maximum temperature is reached. This temperature depends on the component with the lowest tolerance on high temperature.
The final stage of every reflow soldering process is the cooling stage. Gradual cooling is important for achieving the best grain structure of the solder joint, and manufacturers often advice the rate of approximately four degrees per second. Some other similar devices don't include this cooling zone, but experts agree about its importance.
There are different types of SMT soldering ovens, including medium to high volume models, the ones designed as bench top models, and also nitrogen based. Compared to standard devices designed for the same purpose, they provide lower energy consumption and take up less space. Compact and practical, they can find their usage in different processes.
Mid to high volume devices have four independent reflow zones, several thermocouple inputs and LCD touchscreen controls. This type of devices is often used for testing and prototyping. Their stainless steel mesh conveyor accepts up to twenty inch wide boards, and the combination conveyor provides maximum handling flexibility.
The whole process is computer operated and controlled. Parameters can be set automatically, or manually adjusted. The set of parameters can be saved to a memory. Once you reload the saved set, you can adjust individual parameters to suit your present needs. This include specific zone temperature settings and upper and lower limits.
These compact sized models provide very good efficiency, easy handling and low consumption of energy. Advanced thermal management options and other innovative possibilities are making them very useful in all types of industries. Safety systems include audible and visual alarms and automatic shutdown options.
Larger SMT ovens provide up to ten controlled upper and lower full-convection heating zones. They provide maximum functionality, automatic hood-life mechanism and high precision conveyor mechanism. This is a reliable solution for all medium and high volume manufacturers. It combines high mass heat sources with efficient thermal heat transfer, ensuring very good process stability.
SMT reflow soldering oven is very good replacement for standard devices used for attaching electrical components in different types of industries. Small, compact models are very good for schools, labs and small manufacturing processes. High volume models are designed to meet specific needs of high volume manufacturing processes, but all are additionally equipped with back-up batteries.
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